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Ouster (NYSE: OUST) is a leading global provider of high-resolution scanning and solid-state digital lidar sensors, Velodyne Lidar sensors, and software solutions for the automotive, industrial, robotics, and smart infrastructure industries. Ouster is on a mission to build a safer and more sustainable future by offering affordable, high-performance sensors that drive mass adoption across a wide variety of applications. With a global team and high-volume manufacturing, Ouster supports over 850 customers in over 50 countries. Ouster is headquartered in San Francisco, CA with offices in the Americas, Europe, Asia-Pacific, and the Middle East. 

Manufacturing & Electronics

Ouster

Manufacturing

(NYSE: OUST) Lidar hardware and solutions for the automotive, industrial, robotics, and smart infrastructure industries

You need a strong opto-mechanical background, proficiency in Solidworks and Zemax, experience with optics hardware, and a relevant master's degree. Bonus for LiDAR and FEA experience.

You will design and validate opto-mechanical systems, run simulations, create detailed drawings, manage tolerances, collaborate with vendors, and ensure quality meets industry standards.

San Francisco

<div>
 At Ouster, we build sensors and tools for engineers, roboticists, and researchers, so they can make the world safer and more efficient. We've transformed LIDAR from an analog device with thousands of components to an elegant digital device powered by one chip-scale laser array and one CMOS sensor. The result is a full range of high-resolution LIDAR sensors that deliver superior imaging at a dramatically lower price. Our advanced sensor hardware and vision algorithms are used in autonomous cars, drones and many other applications. If you’re motivated by solving big problems, we’re hiring key roles across the company and need your help!
 <br> 
 <br> We are looking for an Opto-Mechanical Engineer to help us build our next generation of LiDARsensors! The ideal candidate will have experience designing and analyzing opto-mechanicalsystems, as well as hands-on experience testing optical hardware. Due to the massive range of use cases for LiDAR, we’re driven to make products which perform in a wide range of thermal and vibration environments. Rigorous opto-mechanical design, analysis, and testing is key to building sensors which can accomplish this. This will be a collaborative role which interfaces with mechanical, electrical, and testing experts. It’s also a unique opportunity to build optical systems for mass production.
 <h3 class="jobSectionHeader"><b> RESPONSIBILITIES:</b></h3>
 <ul>
  <li> Opto-mechanical design from concept to production for next-gen products</li>
  <li> Opto-mechanical simulations to evaluate system performance over wide thermal and vibration environments</li>
  <li> Validating hardware through testing - includes developing test plans and test equipment</li>
  <li> Generation of optical and opto-mechanical component drawings using GD&amp;amp;T standards</li>
  <li> Tolerancing of optical and opto-mechanical components along with an understanding of reasonable fabrication tolerances</li>
  <li> Work with vendors to have high precision optical and opto-mechanical components fabricated and verified</li>
  <li> Work with quality team to ensure our products meet exacting automotive and industrial standards</li>
 </ul>
 <h3 class="jobSectionHeader"><b> BASIC QUALIFICATIONS:</b></h3>
 <ul>
  <li> Strong opto-mechanical fundamentals, with experience doing athermal design a plus</li>
  <li> Strong in Solidworks or equivalent CAD software</li>
  <li> Proficient using Zemax or equivalent optical simulation software</li>
  <li> Proficient with tolerancing and making mechanical drawings</li>
  <li> Experience with the design of bond joints and testing of adhesives</li>
  <li> Experience working with optics hardware</li>
  <li> Experience managing optical component vendors and design consultants</li>
  <li> MS preferred in optical engineering, mechanical engineering, physics, or equivalent</li>
 </ul>
 <h3 class="jobSectionHeader"><b> BONUS QUALIFICATIONS:</b></h3>
 <ul>
  <li> Experience working on LiDAR systems</li>
  <li> Experience working with optical systems destined for production quantities</li>
  <li> Proficient using FEA software such as ANSYS or equivalent</li>
  <li> Proficient with high level programming language (Python, Matlab) for simulation and data analysis</li>
  <li> Experience with Structural, Thermal, Optical Performance (STOP) analysis</li>
  <li> Familiarity with optical alignment and metrology equipment</li>
  <li> Familiarity with stress, thermal, shock &amp;amp; vibe and related reliability tests</li>
  <li> Familiarity with GD&amp;amp;T standards and ISO 10110</li>
 </ul>
 <br> $120,000 - $180,000 a year
 <br> The base pay will be dependent on your skills, work experience, location, and qualifications. This role may also be eligible for equity &amp; benefits.
 <br> We acknowledge the confidence gap at Ouster. You do not need to meet all of these
 <br> requirements to be the ideal candidate for this role.
 <br> 
 <br> At Ouster we offer a range of competitive benefits, as we believe in taking care of our employees in all aspects of their lives. Our newly renovated office, located in the Mission District of San Francisco, is a dog-friendly workplace with a kitchen stocked with snacks, fresh fruit and drinks, and a complimentary dinner catered nightly. Additional perks include 15 vacation days/10 paid holidays annually; paid parental leave; pre-tax commuter or health care/dependent care accounts; 401K match up to 4%; medical, vision and dental plans with premiums covered at 100% for the employee and 75% for dependents (Cigna or Kaiser); life insurance; and short term disability and long term disability. Ouster offers the best benefit options available because we consider the well-being of our employees a top priority.
 <br> 
 <br> <i>Ouster is an Equal Employment Opportunity employer that pursues and hires a diverse workforce. Ouster does not make employment decisions on the basis of race, color, religion, ethnic or national origin, nationality, sex, gender, gender-identity, sexual orientation, disability, age, military status, or any other basis protected by local, state, or federal laws. Ouster also strives for a healthy and safe workplace, and prohibits harassment of any kind. Pursuant to the San Francisco Fair Chance Ordinance, Ouster considers qualified applicants with arrest and conviction records for employment. If you have a disability or special need that requires accommodation, please let us know.</i>
 <p> </p>
 <p>W6nUiGuRC8</p>
</div>


 At Ouster, we build sensors and tools for engineers, roboticists, and researchers, so they can make the world safer and more efficient. We've transformed LIDAR from an analog device with thousands of components to an elegant digital device powered by one chip-scale laser array and one CMOS sensor. The result is a full range of high-resolution LIDAR sensors that deliver superior imaging at a dramatically lower price. Our advanced sensor hardware and vision algorithms are used in autonomous cars, drones and many other applications. If you’re motivated by solving big problems, we’re hiring key roles across the company and need your help!
  
  We are looking for an Opto-Mechanical Engineer to help us build our next generation of LiDARsensors! The ideal candidate will have experience designing and analyzing opto-mechanicalsystems, as well as hands-on experience testing optical hardware. Due to the massive range of use cases for LiDAR, we’re driven to make products which perform in a wide range of thermal and vibration environments. Rigorous opto-mechanical design, analysis, and testing is key to building sensors which can accomplish this. This will be a collaborative role which interfaces with mechanical, electrical, and testing experts. It’s also a unique opportunity to build optical systems for mass production.
  RESPONSIBILITIES:
 
   Opto-mechanical design from concept to production for next-gen products
   Opto-mechanical simulations to evaluate system performance over wide thermal and vibration environments
   Validating hardware through testing - includes developing test plans and test equipment
   Generation of optical and opto-mechanical component drawings using GD&amp;T standards
   Tolerancing of optical and opto-mechanical components along with an understanding of reasonable fabrication tolerances
   Work with vendors to have high precision optical and opto-mechanical components fabricated and verified
   Work with quality team to ensure our products meet exacting automotive and industrial standards
 
  BASIC QUALIFICATIONS:
 
   Strong opto-mechanical fundamentals, with experience doing athermal design a plus
   Strong in Solidworks or equivalent CAD software
   Proficient using Zemax or equivalent optical simulation software
   Proficient with tolerancing and making mechanical drawings
   Experience with the design of bond joints and testing of adhesives
   Experience working with optics hardware
   Experience managing optical component vendors and design consultants
   MS preferred in optical engineering, mechanical engineering, physics, or equivalent
 
  BONUS QUALIFICATIONS:
 
   Experience working on LiDAR systems
   Experience working with optical systems destined for production quantities
   Proficient using FEA software such as ANSYS or equivalent
   Proficient with high level programming language (Python, Matlab) for simulation and data analysis
   Experience with Structural, Thermal, Optical Performance (STOP) analysis
   Familiarity with optical alignment and metrology equipment
   Familiarity with stress, thermal, shock &amp; vibe and related reliability tests
   Familiarity with GD&amp;T standards and ISO 10110
 
  $120,000 - $180,000 a year
  The base pay will be dependent on your skills, work experience, location, and qualifications. This role may also be eligible for equity & benefits.
  We acknowledge the confidence gap at Ouster. You do not need to meet all of these
  requirements to be the ideal candidate for this role.
  
  At Ouster we offer a range of competitive benefits, as we believe in taking care of our employees in all aspects of their lives. Our newly renovated office, located in the Mission District of San Francisco, is a dog-friendly workplace with a kitchen stocked with snacks, fresh fruit and drinks, and a complimentary dinner catered nightly. Additional perks include 15 vacation days/10 paid holidays annually; paid parental leave; pre-tax commuter or health care/dependent care accounts; 401K match up to 4%; medical, vision and dental plans with premiums covered at 100% for the employee and 75% for dependents (Cigna or Kaiser); life insurance; and short term disability and long term disability. Ouster offers the best benefit options available because we consider the well-being of our employees a top priority.
  
  Ouster is an Equal Employment Opportunity employer that pursues and hires a diverse workforce. Ouster does not make employment decisions on the basis of race, color, religion, ethnic or national origin, nationality, sex, gender, gender-identity, sexual orientation, disability, age, military status, or any other basis protected by local, state, or federal laws. Ouster also strives for a healthy and safe workplace, and prohibits harassment of any kind. Pursuant to the San Francisco Fair Chance Ordinance, Ouster considers qualified applicants with arrest and conviction records for employment. If you have a disability or special need that requires accommodation, please let us know.
  
 W6nUiGuRC8


Senior Opto-Mechanical Engineer - Ouster

Senior Opto-Mechanical Engineer

You must have 5+ years in semiconductor package development, experience with ceramic and CMOS packages, wafer processing, automated assembly, and failure analysis tools. Understanding of CMOS architecture is preferred.

You will design microelectronic assemblies, define IC package specs, optimize processes, analyze yields, collaborate with partners, manage vendors, and ensure mass production readiness.

<div>
 At Ouster, we build sensors and tools for engineers, roboticists, and researchers, so they can make the world safer and more efficient. We've transformed LIDAR from an analog device with thousands of components to an elegant digital device powered by one chip-scale laser array and one CMOS sensor. The result is a full range of high-resolution LIDAR sensors that deliver superior imaging at a dramatically lower price. Our advanced sensor hardware and vision algorithms are used in autonomous cars, drones and many other applications. If you’re motivated by solving big problems, we’re hiring key roles across the company and need your help!
 <br> 
 <br> We are looking for a Sensor Packaging Development and Production Engineer to design and develop our IC packaging solutions. We are seeking an adaptable, well-organized engineer who can work between hardware, systems, IC and operations to drive our packaging development. The role is San Francisco based and will include some travel.
 <h3 class="jobSectionHeader"><b> RESPONSIBILITIES:</b></h3>
 <ul>
  <li> Design microelectronic assembly processes for automotive-grade receiver and transmitter packages / modules from wafer fab to package integration</li>
  <li> Define specifications for custom IC package designs and chip carriers to meet product and qualification requirements. Work with external partners to realize those parts</li>
  <li> Plan and execute process optimization and characterization, design validation, failure analysis, and sample builds for package development and automotive qualification</li>
  <li> Lead yield analysis and drive improvement/corrective actions for silicon process and microelectronic assembly</li>
  <li> Collaborate with external manufacturing partners to develop new packaging processes and prototypes to meet IC and system specifications.</li>
  <li> Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of diverse components such as substrates, epoxies, coated glass, PCBAs, and tooling.</li>
  <li> Drive mass production readiness with multiple engineering and operation teams</li>
 </ul>
 <h3 class="jobSectionHeader"><b> BASIC QUALIFICATIONS:</b></h3>
 <ul>
  <li> 5+ years in Semiconductor Package/Process Development or 2+ years with a relevant masters degree.</li>
  <li> Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates</li>
  <li> Experience in wafer level processing (dielectric thin film deposition, RIE silicon processing, wafer-to-wafer bonding, spin coat/lift-off processing, wafer dice and test)</li>
  <li> Experience in automated micro electronic and photonic assembly processes (wafer inspection, high accuracy epoxy/solder die attach, wire bonding, vision inspection, glob top/underfill dispense)</li>
  <li> Working knowledge of Failure Analysis tools such as X-ray, 3D interferometry, DIC microscopy, SEM, cross-section, destructive testing, etc.</li>
  <li> Understanding of CMOS image sensor sensor architecture and operation is preferred</li>
 </ul>
 <h3 class="jobSectionHeader"><b> BONUS QUALIFICATIONS:</b></h3>
 <ul>
  <li> Bachelor's and/or Master's degree in Electrical or Mechanical Engineering</li>
  <li> Experience with optical systems</li>
  <li> Experience with ATE package test environment</li>
  <li> Experience with statistical analysis for volume production processes</li>
  <li> AEC-Q100 or related automotive qualification experience</li>
 </ul>
 <br> $120,000 - $180,000 a year
 <br> The base pay will depend on your skills, work experience, location, and qualifications. This role may also be eligible for equity &amp; benefits.
 <br> We acknowledge the confidence gap at Ouster. You do not need to meet all of these
 <br> requirements to be the ideal candidate for this role.
 <br> 
 <br> At Ouster we offer a range of competitive benefits, as we believe in taking care of our employees in all aspects of their lives. Our newly renovated office, located in the Mission District of San Francisco, is a dog-friendly workplace with a kitchen stocked with snacks, fresh fruit and drinks, and a complimentary dinner catered nightly. Additional perks include 15 vacation days/10 paid holidays annually; paid parental leave; pre-tax commuter or health care/dependent care accounts; 401K match up to 4%; medical, vision and dental plans with premiums covered at 100% for the employee and 75% for dependents (Cigna or Kaiser); life insurance; and short term disability and long term disability. Ouster offers the best benefit options available because we consider the well-being of our employees a top priority.
 <br> 
 <br> <i>Ouster is an Equal Employment Opportunity employer that pursues and hires a diverse workforce. Ouster does not make employment decisions on the basis of race, color, religion, ethnic or national origin, nationality, sex, gender, gender-identity, sexual orientation, disability, age, military status, or any other basis protected by local, state, or federal laws. Ouster also strives for a healthy and safe workplace, and prohibits harassment of any kind. Pursuant to the San Francisco Fair Chance Ordinance, Ouster considers qualified applicants with arrest and conviction records for employment. If you have a disability or special need that requires accommodation, please let us know.</i>
 <br> 
 <p> </p>
 <p>ge6183cOZ3</p>
</div>


 At Ouster, we build sensors and tools for engineers, roboticists, and researchers, so they can make the world safer and more efficient. We've transformed LIDAR from an analog device with thousands of components to an elegant digital device powered by one chip-scale laser array and one CMOS sensor. The result is a full range of high-resolution LIDAR sensors that deliver superior imaging at a dramatically lower price. Our advanced sensor hardware and vision algorithms are used in autonomous cars, drones and many other applications. If you’re motivated by solving big problems, we’re hiring key roles across the company and need your help!
  
  We are looking for a Sensor Packaging Development and Production Engineer to design and develop our IC packaging solutions. We are seeking an adaptable, well-organized engineer who can work between hardware, systems, IC and operations to drive our packaging development. The role is San Francisco based and will include some travel.
  RESPONSIBILITIES:
 
   Design microelectronic assembly processes for automotive-grade receiver and transmitter packages / modules from wafer fab to package integration
   Define specifications for custom IC package designs and chip carriers to meet product and qualification requirements. Work with external partners to realize those parts
   Plan and execute process optimization and characterization, design validation, failure analysis, and sample builds for package development and automotive qualification
   Lead yield analysis and drive improvement/corrective actions for silicon process and microelectronic assembly
   Collaborate with external manufacturing partners to develop new packaging processes and prototypes to meet IC and system specifications.
   Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of diverse components such as substrates, epoxies, coated glass, PCBAs, and tooling.
   Drive mass production readiness with multiple engineering and operation teams
 
  BASIC QUALIFICATIONS:
 
   5+ years in Semiconductor Package/Process Development or 2+ years with a relevant masters degree.
   Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates
   Experience in wafer level processing (dielectric thin film deposition, RIE silicon processing, wafer-to-wafer bonding, spin coat/lift-off processing, wafer dice and test)
   Experience in automated micro electronic and photonic assembly processes (wafer inspection, high accuracy epoxy/solder die attach, wire bonding, vision inspection, glob top/underfill dispense)
   Working knowledge of Failure Analysis tools such as X-ray, 3D interferometry, DIC microscopy, SEM, cross-section, destructive testing, etc.
   Understanding of CMOS image sensor sensor architecture and operation is preferred
 
  BONUS QUALIFICATIONS:
 
   Bachelor's and/or Master's degree in Electrical or Mechanical Engineering
   Experience with optical systems
   Experience with ATE package test environment
   Experience with statistical analysis for volume production processes
   AEC-Q100 or related automotive qualification experience
 
  $120,000 - $180,000 a year
  The base pay will depend on your skills, work experience, location, and qualifications. This role may also be eligible for equity & benefits.
  We acknowledge the confidence gap at Ouster. You do not need to meet all of these
  requirements to be the ideal candidate for this role.
  
  At Ouster we offer a range of competitive benefits, as we believe in taking care of our employees in all aspects of their lives. Our newly renovated office, located in the Mission District of San Francisco, is a dog-friendly workplace with a kitchen stocked with snacks, fresh fruit and drinks, and a complimentary dinner catered nightly. Additional perks include 15 vacation days/10 paid holidays annually; paid parental leave; pre-tax commuter or health care/dependent care accounts; 401K match up to 4%; medical, vision and dental plans with premiums covered at 100% for the employee and 75% for dependents (Cigna or Kaiser); life insurance; and short term disability and long term disability. Ouster offers the best benefit options available because we consider the well-being of our employees a top priority.
  
  Ouster is an Equal Employment Opportunity employer that pursues and hires a diverse workforce. Ouster does not make employment decisions on the basis of race, color, religion, ethnic or national origin, nationality, sex, gender, gender-identity, sexual orientation, disability, age, military status, or any other basis protected by local, state, or federal laws. Ouster also strives for a healthy and safe workplace, and prohibits harassment of any kind. Pursuant to the San Francisco Fair Chance Ordinance, Ouster considers qualified applicants with arrest and conviction records for employment. If you have a disability or special need that requires accommodation, please let us know.
  
  
 ge6183cOZ3


Sensor Package Design Engineer - Ouster

Sensor Package Design Engineer

You should have experience in sensor package design, strong engineering skills, proficiency in relevant software, and a background in optics or electronics. Team collaboration is essential.

You will design sensor packages, collaborate with cross-functional teams, prototype and test products, and optimize designs for performance, cost, and manufacturability in a fast-paced environment.

<div>
 <div>
  <div>
   We are looking for a Sensor Packaging Development and Production Engineer to design and develop our IC packaging solutions. We are seeking an adaptable, well-organized engineer who can work between hardware, systems, IC and operations to drive our packaging development. The role is San Francisco based and will include some travel.
  </div>
 </div> 
 <div>
  <div>
   <h3 class="jobSectionHeader"><b>RESPONSIBILITIES:</b></h3>
   <ul>
    <ul>
     <li> Design microelectronic assembly processes for automotive-grade receiver and transmitter packages / modules from wafer fab to package integration</li>
     <li> Define specifications for custom IC package designs and chip carriers to meet product and qualification requirements. Work with external partners to realize those parts</li>
     <li> Plan and execute process optimization and characterization, design validation, failure analysis, and sample builds for package development and automotive qualification</li>
     <li> Lead yield analysis and drive improvement/corrective actions for silicon process and microelectronic assembly</li>
     <li> Collaborate with external manufacturing partners to develop new packaging processes and prototypes to meet IC and system specifications.</li>
     <li> Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of diverse components such as substrates, epoxies, coated glass, PCBAs, and tooling.</li>
     <li> Drive mass production readiness with multiple engineering and operation teams</li>
    </ul>
   </ul>
  </div>
 </div> 
 <div>
  <div>
   <h3 class="jobSectionHeader"><b>BASIC QUALIFICATIONS:</b></h3>
   <ul>
    <ul>
     <li> 5+ years in Semiconductor Package/Process Development or 2+ years with a relevant masters degree.</li>
     <li> Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates</li>
     <li> Experience in wafer level processing (dielectric thin film deposition, RIE silicon processing, wafer-to-wafer bonding, spin coat/lift-off processing, wafer dice and test)</li>
     <li> Experience in automated micro electronic and photonic assembly processes (wafer inspection, high accuracy epoxy/solder die attach, wire bonding, vision inspection, glob top/underfill dispense)</li>
     <li> Working knowledge of Failure Analysis tools such as X-ray, 3D interferometry, DIC microscopy, SEM, cross-section, destructive testing, etc.</li>
     <li> Understanding of CMOS image sensor sensor architecture and operation is preferred</li>
    </ul>
   </ul>
  </div>
 </div> 
 <div>
  <div>
   <h3 class="jobSectionHeader"><b>BONUS QUALIFICATIONS:</b></h3>
   <ul>
    <ul>
     <li> Bachelor's and/or Master's degree in Electrical or Mechanical Engineering</li>
     <li> Experience with optical systems</li>
     <li> Experience with ATE package test environment</li>
     <li> Experience with statistical analysis for volume production processes</li>
     <li> AEC-Q100 or related automotive qualification experience</li>
    </ul>
   </ul>
  </div>
 </div>
</div>


 
  
   We are looking for a Sensor Packaging Development and Production Engineer to design and develop our IC packaging solutions. We are seeking an adaptable, well-organized engineer who can work between hardware, systems, IC and operations to drive our packaging development. The role is San Francisco based and will include some travel.
  
  
 
  
   RESPONSIBILITIES:
   
    
      Design microelectronic assembly processes for automotive-grade receiver and transmitter packages / modules from wafer fab to package integration
      Define specifications for custom IC package designs and chip carriers to meet product and qualification requirements. Work with external partners to realize those parts
      Plan and execute process optimization and characterization, design validation, failure analysis, and sample builds for package development and automotive qualification
      Lead yield analysis and drive improvement/corrective actions for silicon process and microelectronic assembly
      Collaborate with external manufacturing partners to develop new packaging processes and prototypes to meet IC and system specifications.
      Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of diverse components such as substrates, epoxies, coated glass, PCBAs, and tooling.
      Drive mass production readiness with multiple engineering and operation teams
    
   
  
  
 
  
   BASIC QUALIFICATIONS:
   
    
      5+ years in Semiconductor Package/Process Development or 2+ years with a relevant masters degree.
      Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates
      Experience in wafer level processing (dielectric thin film deposition, RIE silicon processing, wafer-to-wafer bonding, spin coat/lift-off processing, wafer dice and test)
      Experience in automated micro electronic and photonic assembly processes (wafer inspection, high accuracy epoxy/solder die attach, wire bonding, vision inspection, glob top/underfill dispense)
      Working knowledge of Failure Analysis tools such as X-ray, 3D interferometry, DIC microscopy, SEM, cross-section, destructive testing, etc.
      Understanding of CMOS image sensor sensor architecture and operation is preferred
    
   
  
  
 
  
   BONUS QUALIFICATIONS:
   
    
      Bachelor's and/or Master's degree in Electrical or Mechanical Engineering
      Experience with optical systems
      Experience with ATE package test environment
      Experience with statistical analysis for volume production processes
      AEC-Q100 or related automotive qualification experience
    
   
  
 


Ouster

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