FAQs
What are the main responsibilities of a Sensor Package Design Engineer?
The main responsibilities include designing microelectronic assembly processes for automotive-grade packages, defining specifications for custom IC package designs, executing process optimization and characterization, leading yield analysis, collaborating with external manufacturing partners, managing vendors, and driving mass production readiness with engineering and operations teams.
What qualifications are required to apply for this position?
Basic qualifications include 5+ years in Semiconductor Package/Process Development (or 2+ years with a relevant master's degree), experience with multi-layer ceramic and BGA packages, wafer-level processing, automated microelectronic assembly processes, knowledge of Failure Analysis tools, and an understanding of CMOS image sensor architecture.
What additional skills or experiences are considered a bonus for this position?
Bonus qualifications include having a Bachelor's and/or Master's degree in Electrical or Mechanical Engineering, experience with optical systems, knowledge of ATE package testing environments, experience with statistical analysis for volume production, and familiarity with AEC-Q100 or related automotive qualifications.
Where is this job located?
This position is based in San Francisco, California, and will include some travel.
What types of partnerships does a Sensor Package Design Engineer need to manage?
The engineer will need to collaborate with external manufacturing partners to develop new packaging processes and prototypes, as well as manage vendors, which includes sourcing, vetting, quoting, and placing low-volume orders for various components.
Is experience with wafer level processing important for this role?
Yes, experience in wafer level processing—such as dielectric thin film deposition, RIE silicon processing, and wafer-to-wafer bonding—is one of the required qualifications for this role.
What manufacturing practices are essential for this role?
Essential manufacturing practices include automated microelectronic and photonic assembly processes, such as high accuracy epoxy/solder die attach and wire bonding.
Does this position require teamwork and collaboration?
Yes, teamwork and collaboration are crucial as the role involves working with multiple engineering and operations teams to drive mass production readiness and developing packaging solutions with external partners.
What tools are required for failure analysis in this position?
Working knowledge of tools such as X-ray, 3D interferometry, DIC microscopy, SEM, cross-section, and destructive testing techniques is necessary for failure analysis.
Is a specific educational background preferred for this role?
While a Bachelor's or Master's degree in Electrical or Mechanical Engineering is preferred, relevant experience in Semiconductor Package/Process Development is also a requirement.