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Sensor Package Design Engineer

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Ouster

1mo ago

  • Job
    Full-time
    Senior Level
  • San Francisco

AI generated summary

  • You must have 5+ years in semiconductor package development, experience with ceramic and CMOS packages, wafer processing, automated assembly, and failure analysis tools. Understanding of CMOS architecture is preferred.
  • You will design microelectronic assemblies, define IC package specs, optimize processes, analyze yields, collaborate with partners, manage vendors, and ensure mass production readiness.

Requirements

  • **BASIC QUALIFICATIONS:**
  • 5+ years in Semiconductor Package/Process Development or 2+ years with a relevant masters degree.
  • Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates
  • Experience in wafer level processing (dielectric thin film deposition, RIE silicon processing, wafer-to-wafer bonding, spin coat/lift-off processing, wafer dice and test)
  • Experience in automated micro electronic and photonic assembly processes (wafer inspection, high accuracy epoxy/solder die attach, wire bonding, vision inspection, glob top/underfill dispense)
  • Working knowledge of Failure Analysis tools such as X-ray, 3D interferometry, DIC microscopy, SEM, cross-section, destructive testing, etc.
  • Understanding of CMOS image sensor sensor architecture and operation is preferred
  • **BONUS QUALIFICATIONS:**
  • Bachelor's and/or Master's degree in Electrical or Mechanical Engineering
  • Experience with optical systems
  • Experience with ATE package test environment
  • Experience with statistical analysis for volume production processes
  • AEC-Q100 or related automotive qualification experience

Responsibilities

  • Design microelectronic assembly processes for automotive-grade receiver and transmitter packages/modules from wafer fab to package integration
  • Define specifications for custom IC package designs and chip carriers to meet product and qualification requirements. Work with external partners to realize those parts
  • Plan and execute process optimization and characterization, design validation, failure analysis, and sample builds for package development and automotive qualification
  • Lead yield analysis and drive improvement/corrective actions for silicon process and microelectronic assembly
  • Collaborate with external manufacturing partners to develop new packaging processes and prototypes to meet IC and system specifications
  • Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of diverse components such as substrates, epoxies, coated glass, PCBAs, and tooling
  • Drive mass production readiness with multiple engineering and operation teams

FAQs

What is the primary focus of the Sensor Package Design Engineer position at Ouster?

The primary focus of the Sensor Package Design Engineer position is to design and develop IC packaging solutions for automotive-grade receiver and transmitter packages/modules, working across hardware, systems, IC, and operations to drive packaging development.

What qualifications are required for the Sensor Package Design Engineer role?

Candidates should have 5+ years in Semiconductor Package/Process Development or 2+ years with a relevant master's degree, as well as experience with multi-layer ceramic, CMOS image sensors, BGA packages, wafer level processing, and automated microelectronic and photonic assembly processes.

Is experience with optical systems a requirement for this role?

While not a requirement, experience with optical systems is considered a bonus qualification for the Sensor Package Design Engineer position.

What level of education is preferred for candidates applying to this role?

A Bachelor's and/or Master's degree in Electrical or Mechanical Engineering is preferred, although other related qualifications may also be acceptable.

Will there be opportunities for collaboration with external partners?

Yes, the role involves collaboration with external manufacturing partners to develop new packaging processes and prototypes that meet IC and system specifications.

What are the working conditions for this job?

This role is based in San Francisco and includes some travel. The office environment is dog-friendly and offers a range of amenities and benefits for employees.

What is the salary range for the Sensor Package Design Engineer position?

The salary range for this position is $120,000 to $180,000 a year, depending on skills, work experience, location, and qualifications.

Does Ouster offer benefits to its employees?

Yes, Ouster offers a comprehensive range of benefits, including medical, vision, dental plans, paid vacation, parental leave, 401K match, and more, to ensure the well-being of its employees.

Are there any health and safety policies in place at Ouster?

Yes, Ouster strives for a healthy and safe workplace and prohibits harassment of any kind, in line with their commitment to diversity and inclusion.

What is the approach of Ouster towards diversity and equal opportunity in hiring?

Ouster is an Equal Employment Opportunity employer that pursues and hires a diverse workforce, making employment decisions based on qualifications without regard to race, color, religion, gender, or other protected characteristics.

Ouster

(NYSE: OUST) Lidar hardware and solutions for the automotive, industrial, robotics, and smart infrastructure industries

Manufacturing & Electronics
Industry
201-500
Employees
2015
Founded Year

Mission & Purpose

Ouster (NYSE: OUST) is a leading global provider of high-resolution scanning and solid-state digital lidar sensors, Velodyne Lidar sensors, and software solutions for the automotive, industrial, robotics, and smart infrastructure industries. Ouster is on a mission to build a safer and more sustainable future by offering affordable, high-performance sensors that drive mass adoption across a wide variety of applications. With a global team and high-volume manufacturing, Ouster supports over 850 customers in over 50 countries. Ouster is headquartered in San Francisco, CA with offices in the Americas, Europe, Asia-Pacific, and the Middle East.